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Großhandelspreis 3 heatpipes aluminum extruded copper base soldering heat sink for cpci cpu and chipset

Kategorie:

Beschreibung

Produktbeschreibung
Anwendung
IPC
Heat Source Type
Intel/AMD/Nvidia/ARM/SWCPU/Phytium/Loongsun
Heat Source Power
60W
Max Sink Type
80W
Heat Sink Type
3 Heatpipes/Aluminum Extrution/Nickel Plated/CNC/Copper Base/Soldering
Outer Dinension
120mm*90mm*26.5mm
Hole Dimension
According to PCB
Fastener
Screw&Frühling
Tim
Grease//Shin Estu X-23-7762//K=4.2
Gewicht(KG)
0.37

Zusätzliche Information

Art:

Heatsink

Heatsink Material:

Aluminium

Zertifizierung:

RoHS, Sgs

Leistung:

N/A

Air Volume:

N/A

Lärm:

N/A

Fan Size:

N/A

Power Interface:

N/A

Fan Speed Control:

N/A

Anwendung:

IPC, IPC

Markenname:

N/A

Modellnummer:

29-DT190817

Herkunftsort:

Guangdong, China

Heat Source Type:

Intel/AMD/Nvidia/ARM/SWCPU/Phytium/Loongsun

Heat Source Power:

60W

Max Sink Type:

80W

Heat Sink Type:

3 Heatpipes/Aluminum Extrution/Nickel Plated/CNC/Copper Base/Soldering

Outer Dinension:

120mm*90mm*26.5mm

Hole Dimension:

" According to PCB "

Fastener:

Screw

Tim:

Grease//Shin Estu X-23-7762//K=4.2

Gewicht(KG):

0.37